Access Time:
Contact Plating:
Core Processor:
DAC Channels:
Data Rate:
Factory Lead Time:
JESD-609 Code:
Max Power Dissipation:
Memory Size:
Moisture Sensitivity Level (MSL):
Number of Pins:
Number of Terminations:
Part Status:
Peak Reflow Temperature (Cel):
Program Memory Type:
ROM (words):
Supply Current-Max:
Terminal Pitch:
Time@Peak Reflow Temperature-Max (s):
Voltage - Supply:
RFQ
BOM